@Air Compressor
2025-04-18
How much nitrogen concentration can blow the wafer?
During semiconductor manufacturing, nitrogen is used to blow wafers mainly to clean the wafer surface, remove moisture, impurities and possible pollutants, and prevent wafer oxidation.
In general, in order to ensure the cleanliness of the wafer surface and prevent oxidation, the recommended nitrogen concentration should be no less than 99.5%. High-purity nitrogen can effectively remove oxygen and moisture from the air and avoid contamination or oxidation of the wafer.
Of course, the specific nitrogen concentration requirements may vary depending on the process. In practical applications, the appropriate nitrogen concentration should be determined based on specific process requirements and equipment specifications.